Our silicon proven UCIE-S Interconnect IP Solutions, offer industry-leading power efficiency, performance, and low latency, tailored for the next generation of consumer electronics, automotive, high-performance computing, AI, and data center applications.

Key Features

l  Supports MCM, BGA packages and Chiplet2Chiplet interconnects on PCB

l  Available process nodes: 28, 22, 16, 12, 7, 6nm

l  X16 and X32 PHY with bump maps defined in UCIe 2.0 specifications

l  Industry leading power consumption

l  Supports speeds: (Depends on channel insertion loss)

o    Grand L: 4, 8, 12 and 16Gbps

o    Grand H: 24 and 32Gbps

l  Extreme low End-to-end Latency

l  Patented voltage and Temperature Adaptive receiver to compensate voltage and temperature changes during transmission, result in zero or extreme low BER (Bit-Error-Rate).

l  Real-time per lane data-eye monitor to monitor the health of each lane real time

l  UCIe Controller supports all UCIe defined interfaces, AXI and CXS.